Modeling next-generation avionics microprocessors and custom FPGAs before committing designs to physical silicon.
Fabricating radiation-hardened or high-assurance aerospace ASICs costs millions of dollars per tape-out. Discovering an architectural bottleneck after fabrication is financially catastrophic.
Engineers model memory buses, DMA engines, and cache coherency protocols at high levels of abstraction, evaluating memory throughput and worst-case interrupt latency long before physical chip tape-out.
SystemC models allow software teams to write, debug, and certify flight firmware months before initial silicon samples return from semiconductor foundries.